The TSMC-SoIC is a service platform that provides innovative
front-end, 3D inter-chip staking technology for re-integration of chips
partitioned from System on Chip. What happens after the integration is that we
have an integrated chip that outperforms the original SoC its derived from. The
system performance is incredible.
There are multiple benefits of these integrated chips. They are
flexible and can integrate additional system functionalities into itself. The increased
bandwidth and lower latency allow it to perform quickly and meet the
requirements of the ever-increasing computing.
Let’s take a look at the following infographic for an
in-depth look at these powerful chips.
Infographic by: tsmc
